Silicon Photonics / Optical Packaging Engineer
Apple
Cupertino, CA, USA
Posted on Oct 22, 2024
Summary
Posted:
Weekly Hours: 40
Role Number:200574465
Silicon photonics (SiPh) technology is crucial for realizing next-generation optical interconnects already implemented in data center connectivity and ready to penetrating into short distance within the boards. One critical technology to realize high-volume, low-cost SiPh optical interconnect applications is the development of high efficient optical I/O module architecture, assembly, optical coupling design and process for single-mode fiber packaging. We are looking for a hardworking and passionate Si photonics & optical Packaging Engineer to join our team. In this highly visible role, you will develop Si photonics engine/chiplet packaging and co-packaging solutions using advanced packaging technologies, define assembly baseline processes, decide package BOM, establish optical coupling design/manufacturing that are optimized for performance, reliability, yield and cost.
Description
Responsible to lead Si photonics packaging technology development. Work with multi-functional team and lead optical engine module, optical coupling design/fiber array connector and co-packaging optics development efforts. Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation Work with optical component vendors, foundry and OSAT to bring Si photonics packaging solution from concept to HVM. Minimum 5% International travel.
Minimum Qualifications
- Excellent teamwork and communication skills
- Strong theoretical background in optics and photonics fundamentals, device/module integration
- M.S. in Physic (Optics major), Electrical Engineering, Materials Science, Mechanical Engineering or an equivalent field desired.
- Min. 3 years works experiences in the related field
- Hands-on experience in packaging and measuring fiber-coupled devices
- Hands-on experience in optical component design, simulation and qualification, and single / multi-mode fiber assembly using active and passive alignment tool
Key Qualifications
Preferred Qualifications
- Ph.D in Physic (Optics major), Electrical Engineering, Materials Science, Mechanical Engineering or an equivalent field desired.
- Min. 5 years works experiences in the related field
- Hands-on experience of CMOS BEOL wafer scale processing and flip chip assembly (CoC, CoW, WLP, …) and experience with silicon photonics device (laser, modulator, PD, passive components such as Si WG, MUX/DeMUX is a plus
Education & Experience
Additional Requirements
Pay & Benefits
Apple is an equal opportunity employer that is committed to inclusion and diversity. We take affirmative action to ensure equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant.