Display Module Assembly and Packaging Engineer
Apple
Santa Clara, CA, USA
Posted on Oct 19, 2024
Summary
Posted:
Role Number:200573206
Do something different! Apple is seeking a hardworking and experienced Engineer to join our display module team. In this role, your primary responsibility will be focused on display hardware development and validation for the next generation Apple product. You will collaborate closely with multi-functional teams and suppliers to ensure the successful implementation of new display technologies and drive engineering excellence from initial concept to final mass production. This pivotal position demands proactive problem-solving across technical domains. A successful candidate needs to be highly independent and results driven, have strong presentation and communication skills, and can thrive in a fast pace and highly dynamic environment.
Description
- Own overall mechanical and module master specifications from initial concept to mass production, and drive rigorous validation plan to meet performance - Define new display optical package special characteristics based on unique module and system level performance, cost, and footprint requirements. Conduct initial package layout and architecture scoping and sign off the final package design. - Define and develop a MP assembly process. This includes, but not limited to, the initial proof of concept work, novel process, equipment and materials development work, FMEA, process control plan, IQC and OQC, failure analysis, yield analysis and enhancement work. - Lead multi-functional teams, collaborate with key stack holders to iterate design, set clear goals and priorities throughout the product development phases, drive display module design convergence, and ensure successful display product ramp. - Identify and assesses critical metrics affecting display performance, analyze experimental and build data, address process limitation, and follow through between modeling and as-built performance - Ability to communicate effectively across the organization, influence other teams, manage risk, make decisions with limited amount of information, deliver against a fast-paced development schedule are key requirements. - Travel to support build at component, module, and system factories during critical new product introduction phases
Minimum Qualifications
- BS with 3+ years of semiconductor packaging/assembly experience
Key Qualifications
Preferred Qualifications
- M.S or Ph.D. in Mechanical Engineering, Physics, Materials Science, Electrical Engineering or similar fields
- Prior optical packaging experience with camera/CMOS image sensor module, LED, photodiode and optical component integrations and system interactions
- Solid fundamentals in electrical/material/thermal/mechanical engineering field
- Familiarity with various sophisticated package configurations and assembly / substrate technology (wirebond, CoWoS, BGA, POP, etc.). Experience with TSV, 2D/2.5D and 3D package connection
- Substrate manufacturing process, structure, design rules and material property
Education & Experience
Additional Requirements
Pay & Benefits
Apple is an equal opportunity employer that is committed to inclusion and diversity. We take affirmative action to ensure equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant.