IC Package Design Engineer
Apple
Summary
Description
Minimum Qualifications
- BS and 3+ years of relevant industry experience.
Key Qualifications
Preferred Qualifications
- As the IC Package Design Engineer, you demonstrate fundamental knowledge or proven experience in the following:
- Proven fundamentals in the electrical/material/thermal/ or mechanical engineering field(s).
- Familiarity with various sophisticated package configurations and assembly/ substrate technology (wirebond, POP, etc.).
- Experience in package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools.
- Basic understanding in some SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters and RLGC model.
- Basic knowledge of substrate manufacturing process, structure, design rules and material property.
- Proven understanding of high-speed interfaces, including DDR, PCIe, NAND, etc.
- Exposure to Unix environment, scripting languages (PERL, Python, TCL and or shell) and methodology.
- Preferred Skills:
- Familiarity with CAM350/Valor or Calibre and CAD and experience with package design reviews.
- Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs, EMI/RFI, PCB/package resonance).
- Design experience with RFIC and 5G packages, SIP or module schematic and layout design experience.
- Solid understanding of Design Rules Check and Design for Manufacturing.
Education & Experience
Additional Requirements
Pay & Benefits
Apple is an equal opportunity employer that is committed to inclusion and diversity. We take affirmative action to ensure equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant.